Abstract

In this paper, we report on an analysis carried out by using cyclic voltammetric (CV) and chronoamperometric (CA) techniques on the reaction and nucleation mechanisms of electrodeposited copper on indium-doped tin oxide (ITO)-coated glass substrates from sulfate solutions. The present investigation has been performed in an acid solution at pH 5. The Scharifker and Hills model were used to analyze current transients. At relatively low overpotentials, the copper deposition can be described by a model involving instantaneous nucleation on active sites and diffusion-controlled 3D growth. The values of diffusion coefficient D for Cu2+ ions are estimated. Atomic force microscopy (AFM) has been used to check on the samples surface morphology.

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